נפקון אסיה – ICPF 2027
IC Packaging Fair (ICPF)
ICPF is a specialist semiconductor packaging and testing exhibition held alongside NEPCON ASIA at Shenzhen World Exhibition & Convention Center in Bao'an, Shenzhen, China. The next edition runs October 27-29, 2027.
The fair brings together domestic packaging and testing factories, IDM brands with in-house packaging and testing processes, and leading electronics manufacturing service providers. It focuses on the packaging and testing processes of core products such as semiconductor ICs, power devices, optoelectronic devices and sensors, and displays advanced equipment and materials across the whole packaging and test flow as a one-stop sourcing platform.
פרופיל האדם/האובייקט
- Core equipment for integrated circuits and advanced packaging and testing: die bonders, chip bonders, glass bonding machines, flip chip bonders, wire bonders, molding machines, etching machines, optical cutting machines, lithography machines, vacuum coating machines and PVD sputtering machines.
- Core equipment for power semiconductor packaging and testing: die bonders, chip bonders, sintering furnaces, wire and wedge bonders, dispensing equipment, molding machines and ultrasonic scanners.
- Core equipment for optoelectronic semiconductor packaging and testing: die bonders, chip bonders, ball bonders, underfill dispensers, automatic capping machines and high-low temperature testers for laser diode and optical components.
- Peripheral and testing equipment and materials: wafer thinners, AOI inspection systems, functional testers, electroplating equipment, push-pull testers, silver paste, heat sinks, ceramic substrates, bonding wire and process chemicals.
התמקדו של התוכנית
The show floor is complemented by an equipment and materials showcase, an international semiconductor packaging technology forum, a semiconductor packaging and testing process demonstration zone, and monthly thematic business matching sessions. Demonstration lines cover integrated circuits and advanced packaging, IGBT and SiC modules, and 800G/1.6T optical modules. The accompanying ICPF Semiconductor Technology and Innovation Conference addresses SiP and advanced packaging, power semiconductor technology and applications, and optoelectronic device packaging and testing.
מי נוכח/משתתף
The target audience includes engineering and manufacturing teams from OSATs, in-house IDM packaging operations, and design and R&D departments at IDMs, alongside procurement and process engineering visitors from the wider electronics manufacturing supply chain.
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מפת המקום והמלונות השונים שנמצאים בסביבה
שנגחאי – מרכז התערוכות והירידים העולמיים של שנגחאי, גואנגדונג, סין