InterNEPCON Japan (Electronics Manufacturing and Mounting Exhibition) 2027
From
February 17, 2027
until
February 19, 2027
(Please double-check the dates and location on the organizer below before attending.)
Categories: Electronics Industry
ELECTRONIC COMPONENTS MATERIALS EXPO
Part of NEPCON JAPAN, this is Japan’s leading exhibition dedicated to electronic components and materials. The event serves as a key platform for industry professionals to discover the latest innovations and connect with top suppliers in the electronics manufacturing sector.
Exhibit Categories
- Electronic Components: Condensers, capacitors, connectors, sensors, switches, semiconductors, and more.
- Electronic Materials: Circuit board materials, semiconductor packaging materials, adhesives, and advanced films.
Visitor Profile
The expo targets manufacturers across a wide range of industries, including:
- Electric/Electronic Devices
- Medical Devices
- Aircraft/Aerospace Devices
- Automobiles & Automotive Components
- Semiconductor Assembly
- LED
Co-located Events
The exhibition is held concurrently with other major trade shows such as INTERNEPCON JAPAN, ELECTROTEST JAPAN, IC SENSOR PACKAGING EXPO, PWB EXPO, FINE PROCESS TECHNOLOGY EXPO, Power Device and Module Expo, and EMS & ODM EXPO.
Register for entry or booths
Please register at the organizer website of InterNEPCON Japan (Electronics Manufacturing and Mounting Exhibition)
Venue Map and Hotels Around
Koto - Tokyo Big Sight, Tokyo, Japan