Microelectronics Packaging & Integration Symposium 2027
The Microelectronics Packaging & Integration Symposium is SMTA's flagship conference on advanced semiconductor packaging. Formerly the Wafer-Level Packaging Symposium, the event reflects the industry's shift toward wafer- and panel-level processes, 3D integration, heterogeneous assembly, advanced manufacturing, test, and metrology. The symposium brings together engineers, researchers, and suppliers to share technical sessions, keynotes, exhibition space, and professional development courses focused on packaging challenges driven by AI, HPC, and complex system designs. The 2027 edition is scheduled at The Westin San Francisco Airport in the San Francisco Bay Area, California.
רוצים להירשם לקבלת פרסים או להשתתף בחלוקה של פרסים? ראו את ההרשמות המתאימות.
מפת המקום והמלונות השונים שנמצאים בסביבה
Millbrae - The Westin San Francisco Airport Hotel, California, United States